In today’s industrial and power electronics markets, manufacturers are facing growing challenges as devices are required to operate reliably in increasingly harsh environments. Applications such as motor drives, power supplies, inverters, battery management systems, HVAC control units, and industrial sensors are continuously exposed to heat, humidity, vibration, and chemically aggressive conditions. These factors significantly increase the risk of corrosion, silver migration, insulation degradation, and early component failure, creating strong demand for advanced polyurethane potting solutions that can ensure long-term protection and performance.
As a global leader in electronic materials and encapsulation technologies, Henkel addresses these challenges with the introduction of Loctite STYCAST US 8000 A/B, a next-generation two-component polyurethane potting compound. Designed specifically for industrial and power electronics, the new material expands Henkel’s high-performance potting and encapsulation portfolio, helping manufacturers improve reliability, extend product lifetime, and meet increasingly strict quality and compliance requirements.
Designed for Long-Term Reliability in Harsh Environments
Loctite STYCAST US 8000 A/B is engineered to provide durable internal protection for sensitive electronic assemblies. Its ultra-low ionic content (below 20 ppm) effectively reduces the risk of corrosion and silver migration, particularly in high-humidity environments where leakage currents and short circuits commonly occur. This makes the material well suited for applications requiring stable electrical performance over extended service life.
The polyurethane potting compound offers proven thermal and safety performance, with a UL 746 Relative Thermal Index (RTI) of 140°C and UL 94 V-0 flammability certification. Electrically, it delivers a dielectric strength of 24 kV/mm and maintains surface insulation resistance above 10⁸ Ω even after prolonged exposure to 85°C and 85% relative humidity, ensuring consistent insulation stability under extreme operating conditions.
Process Efficiency and Manufacturing Flexibility
In addition to performance benefits, Loctite STYCAST US 8000 A/B is optimized for efficient production. Its low mixed viscosity, combined with a standard 4:1 mixing ratio, enables smooth dispensing and excellent flow into narrow gaps and complex geometries. This supports void-free encapsulation and reliable protection of densely packed electronic components.
The material can cure at room temperature or through accelerated heat curing schedules, providing manufacturers with greater process flexibility while helping reduce energy consumption. Its balanced mechanical properties — including Shore A hardness of 89, tensile strength of 9 MPa, and elongation of 87% — allow it to absorb vibration and accommodate thermal expansion without cracking or loss of adhesion.
Supporting the Next Generation of Industrial Electronics
“At Henkel, we are committed to supporting the development of reliable and energy-efficient electronic systems,” said Eric Zhai, Global Senior Market Strategy Manager for Power & Industrial Automation at Henkel Adhesive Technologies. “With the launch of Loctite STYCAST US 8000 A/B, we are expanding our advanced protection portfolio to help customers address increasingly demanding environmental and regulatory requirements.”
Backed by a global innovation network, dedicated electronics laboratories, and close collaboration with OEMs and Tier suppliers, Henkel continues to invest in next-generation encapsulation and potting materials. These efforts aim to accelerate adoption of advanced polyurethane potting solutions across critical industrial and power electronics applications.
“Through strong partnerships with our customers, Henkel delivers materials that enhance reliability, compliance, and long-term sustainability,” Eric Zhai added. “Loctite STYCAST US 8000 A/B demonstrates how innovation can move efficiently from concept to production, helping manufacturers reduce field failures, extend equipment lifespan, and meet the evolving demands of modern electronic systems.”
0 comments